The application of an analytical model to solve an inverse heat conduction problem: transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates

Curtulo, Joanisa P.; Dias, Marcelino; Bertelli, Felipe; Silva, Bismarck Luiz; Spinelli, José Eduardo; Garcia, Amauri; Cheung, Noé

The application of an analytical model to solve an inverse heat conduction problem: transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates

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dc.contributor.author	Curtulo, Joanisa P.
dc.contributor.author	Dias, Marcelino
dc.contributor.author	Bertelli, Felipe
dc.contributor.author	Silva, Bismarck Luiz
dc.contributor.author	Spinelli, José Eduardo
dc.contributor.author	Garcia, Amauri
dc.contributor.author	Cheung, Noé
dc.date.accessioned	2021-04-12T20:43:47Z
dc.date.issued	2019-12
dc.description.embargo	2021-01
dc.description.resumo	Three distinct alloy/substrate couples were considered. In order to treat the reaction interface problem effectively, sheets of commercially pure copper (Cu), electrolytic nickel (Ni) and low carbon steel were chosen so that solidification of a Sn-Sb peritectic alloy could be evaluated comprehending very different conditions. A straightforward view of the mechanisms affecting the heat transfer efficiencies was consistent with a number of techniques applied in the present investigation, which includes directional solidification experiments, analytical modelling, wettability analyses and characterization of the reactions between the alloy and the substrates. The proposed analytical model was perceptive to these reactions. For the Cu substrate, the motion of Cu towards the alloy was more effective as compared to the motion of Ni from the Ni substrate. As a consequence, the alloy/Cu interface presented a higher level of Kirkendall voids. The higher fraction of voids at the interface resulted in lower interfacial thermal conductance for the Sn-Sb/Cu couple. Hence, the present experimental-theoretical approach is useful to indicate the solder joint integrity in terms of the presence of empty spots. Despite the higher thermal conductivity of Cu and lower contact angle between the alloy and the Cu in comparison to the Ni substrate, the high porosity at the Cu interface during alloy soldering was shown to reduce the heat transfer capability	pt_BR
dc.identifier.citation	CURTULO, Joanisa P.; DIAS, Marcelino; BERTELLI, Felipe; SILVA, Bismarck L.; SPINELLI, José E.; GARCIA, Amauri; CHEUNG, Noé. The application of an analytical model to solve an inverse heat conduction problem: transient solidification of a sn-sb peritectic solder alloy on distinct substrates. Journal of Manufacturing Processes, [S.L.], v. 48, p. 164-173, dez. 2019. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S1526612519303706?via%3Dihub. Acesso em: 05 mar. 2021. http://dx.doi.org/10.1016/j.jmapro.2019.10.029	pt_BR
dc.identifier.doi	10.1016/j.jmapro.2019.10.029
dc.identifier.issn	1526-6125
dc.identifier.uri	https://repositorio.ufrn.br/handle/123456789/32177
dc.language	en	pt_BR
dc.publisher	Elsevier	pt_BR
dc.rights	Attribution 3.0 Brazil	*
dc.rights.uri	http://creativecommons.org/licenses/by/3.0/br/	*
dc.subject	Sn-Sb alloy	pt_BR
dc.subject	Peritectic	pt_BR
dc.subject	Heat transfer	pt_BR
dc.subject	Analytical model	pt_BR
dc.subject	Solidification	pt_BR
dc.subject	Wettability	pt_BR
dc.subject	Interface	pt_BR
dc.title	The application of an analytical model to solve an inverse heat conduction problem: transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates	pt_BR
dc.type	article	pt_BR