Solder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloys

Autores		Silva, Bismarck Luiz; Bertelli, Felipe; Canté, Manuel Venceslau; Spinelli, José Eduardo; Cheung, Noé; Garcia, Amauri
Editor		Springer
Data		2015-10-31
Palavras-chave		Contact Angle Heat Transfer Coefficient Solder Alloy Directionally Solidify Volumetric Expansion
Citação		SILVA, Bismarck Luiz; BERTELLI, Felipe; CANTÉ, Manuel V.; SPINELLI, José E.; CHEUNG, Noé; GARCIA, Amauri. Solder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloys. Journal Of Materials Science: Materials in Electronics, [S.L.], v. 27, n. 2, p. 1994-2003, 31 out. 2015. Disponível em: https://link.springer.com/article/10.1007%2Fs10854-015-3983-2. Acesso em: 27 jan. 2021. http://dx.doi.org/10.1007/s10854-015-3983-2
Resumo
URI		https://repositorio.ufrn.br/handle/123456789/31883