Wetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys: insights into factors affecting cooling rate

Autores		Silva, Bismarck Luiz; Garcia, Amauri; Spinelli, José Eduardo
Editor		Elsevier
Data		2019
Palavras-chave		Solder alloys Solidification Wettability Thermal analysis
Citação		Silva, B.L.; Garcia, A. ; SPINELLI, J. E. . Wetting behavior of Sn-Ag-Cu and Sn-Bi-X alloys: insights into factors affecting cooling rate. Journal of Materials Research and Technology-JMR&T, v. 8, p. 1581-1586, 2019. Disponível em: https://www.sciencedirect.com/science/article/pii/S2238785418302254?via%3Dihub. Acesso em: 21 jan. 2021. https://doi.org/10.1016/j.jmrt.2018.06.016
Resumo
URI		https://repositorio.ufrn.br/handle/123456789/31679