Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels

Lima, Thiago Soares; Silva, Bismarck Luiz; Garcia, Amauri; Cheung, Noé; Spinelli, José Eduardo

Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels

Página do item simplificado Estatísticas

dc.contributor.author	Lima, Thiago Soares
dc.contributor.author	Silva, Bismarck Luiz
dc.contributor.author	Garcia, Amauri
dc.contributor.author	Cheung, Noé
dc.contributor.author	Spinelli, José Eduardo
dc.date.accessioned	2021-03-10T14:48:08Z
dc.date.available	2021-03-10T14:48:08Z
dc.date.issued	2018-06-22
dc.description.resumo	The dependences of microstructures on the solidification thermal parameters of Sn–0.5 wt.%Cu, Sn–0.5 wt.%Cu–0.05 wt.%Al, and Sn–0.5 wt.%Cu–0.1 wt.%Al alloys are examined. Ranges of sizes and morphologies of microstructural phases have been quantitatively assessed due to the broad spectra of cooling rates and thermal gradients associated with the experiments. Various types of growth relations are proposed to represent the microstructural progresses. Al addition does not change either the matrix primary dendritic spacing or the spacing between Cu6Sn5 particles. However, it is shown that the secondary dendrite arm spacing, λ2, is greatly affected, increasing with the increase in the Al content. Both globular-type and fibrous-type morphologies typify the Cu6Sn5 intermetallics located in interdendritic zones	pt_BR
dc.identifier.citation	LIMA, Thiago Soares; SILVA, Bismarck Luiz; GARCIA, Amauri; CHEUNG, Noé; SPINELLI, José Eduardo. Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels. Proceedings of The Institution of Mechanical Engineers, Part L: Journal of Materials, [S.L.], v. 233, n. 9, p. 1733-1737, 22 jun. 2018. Disponível em: https://journals.sagepub.com/doi/10.1177/1464420718784314. Acesso em: 25 jan. 2021. http://dx.doi.org/10.1177/1464420718784314	pt_BR
dc.identifier.doi	10.1177/1464420718784314
dc.identifier.issn	1464-4207
dc.identifier.issn	2041-3076
dc.identifier.uri	https://repositorio.ufrn.br/handle/123456789/31788
dc.language	en	pt_BR
dc.publisher	SAGE Publications	pt_BR
dc.rights	Attribution-NonCommercial 3.0 Brazil	*
dc.rights.uri	http://creativecommons.org/licenses/by-nc/3.0/br/	*
dc.subject	Sn–Cu–Al alloys	pt_BR
dc.subject	Solders	pt_BR
dc.subject	Solidification	pt_BR
dc.subject	Microstructure	pt_BR
dc.subject	Intermetallics	pt_BR
dc.subject	Eutectic	pt_BR
dc.title	Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels	pt_BR
dc.type	article	pt_BR