Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels

Autores		Lima, Thiago Soares; Silva, Bismarck Luiz; Garcia, Amauri; Cheung, Noé; Spinelli, José Eduardo
Editor		SAGE Publications
Data		2018-06-22
Palavras-chave		Sn–Cu–Al alloys Solders Solidification Microstructure Intermetallics Eutectic
Citação		LIMA, Thiago Soares; SILVA, Bismarck Luiz; GARCIA, Amauri; CHEUNG, Noé; SPINELLI, José Eduardo. Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels. Proceedings of The Institution of Mechanical Engineers, Part L: Journal of Materials, [S.L.], v. 233, n. 9, p. 1733-1737, 22 jun. 2018. Disponível em: https://journals.sagepub.com/doi/10.1177/1464420718784314. Acesso em: 25 jan. 2021. http://dx.doi.org/10.1177/1464420718784314
Resumo
URI		https://repositorio.ufrn.br/handle/123456789/31788